高可靠性電子裝備PCBA設(shè)計(jì)缺陷案例分析及可制造性設(shè)計(jì)

目錄
第1章總則
1.1　概述 ................................................................................................................................1
1.2　我國(guó)電子制造業(yè)面臨的困境 ..................................................................................2
1.2.1 困境之一：高端芯片的缺失 .............................................................................2
1.2.2 困境之二：DFM的嚴(yán)重缺失 ...........................................................................4
1.2.3 困境之三：不適應(yīng)先進(jìn)生產(chǎn)力發(fā)展的舊工藝管理體制 .................................6
1.2.4 困境之四：被嚴(yán)重低估了的工藝和制造價(jià)值 .................................................7
1.2.5 被扭曲了的電子裝聯(lián)標(biāo)準(zhǔn) ................................................................................8
1.3　實(shí)現(xiàn)高可靠質(zhì)量目標(biāo)的因素 ..................................................................................9
1.4　中國(guó)制造需要“大國(guó)工藝” ..................................................................................10
1.4.1 精湛的工匠技藝源自先進(jìn)的工藝技術(shù) ...........................................................10
1.4.2 電子裝聯(lián)技術(shù)的重要性 ...................................................................................11
1.5　先進(jìn)制造技術(shù) ...........................................................................................................12
1.5.1 什么是先進(jìn)制造技術(shù) .......................................................................................12
1.5.2 電氣互連先進(jìn)制造技術(shù) ...................................................................................12
1.5.3 新型元器件與高密度組裝技術(shù) .......................................................................12
1.5.4 微組裝先進(jìn)制造技術(shù) .......................................................................................13
1.5.5 可制造性設(shè)計(jì)是實(shí)現(xiàn)先進(jìn)制造技術(shù)的前提和技術(shù)支撐 ...............................13
1.6　可制造性設(shè)計(jì)理念的拓展.....................................................................................14
1.7　結(jié)束語(yǔ) .........................................................................................................................15
第2章PCB/PCBA設(shè)計(jì)缺陷案例分析
2.1　焊盤尺寸設(shè)計(jì)缺陷 ..................................................................................................16
2.1.1 片式元器件焊盤設(shè)計(jì)缺陷 ...............................................................................17
2.1.2 片式元器件錯(cuò)誤的“常見病、多發(fā)病” ........................................................20
2.1.3 焊盤兩端不對(duì)稱，走線不規(guī)范 .......................................................................21
2.1.4 焊盤寬度及相互間距離不均勻 .......................................................................23
2.1.5 IC焊盤寬度間距過(guò)大 ......................................................................................23
2.1.6 QFN焊盤設(shè)計(jì)缺陷 ..........................................................................................24
2.1.7 安裝孔金屬化，焊盤設(shè)計(jì)不合理 ...................................................................25
2.1.8 共用焊盤問(wèn)題導(dǎo)致的缺陷 ...............................................................................26
2.1.9 熱焊盤設(shè)計(jì)不合理 ...........................................................................................26
2.1.10 片式電容器焊盤長(zhǎng)度設(shè)計(jì)不合理 .................................................................28
2.1.11 其他焊盤設(shè)計(jì)缺陷 .........................................................................................28
2.2　絲網(wǎng)和阻焊膜設(shè)計(jì)不良 .........................................................................................30
2.2.1 絲網(wǎng)設(shè)計(jì)不良 ...................................................................................................30
2.2.2 阻焊膜設(shè)計(jì)不良 ...............................................................................................33
2.3　元器件布局不合理 ..................................................................................................35
2.3.1 布局設(shè)計(jì)不良 ...................................................................................................35
2.3.2 應(yīng)用波峰焊接工藝時(shí)，元器件布局沒(méi)有采取克服“陰影效應(yīng)”措施 .......37
2.3.3 元器件的排布不符合工藝要求 .......................................................................37
2.3.4 安放在PCB焊接面的QFP和SOIP沒(méi)有設(shè)計(jì)成“菱形”和設(shè)計(jì)導(dǎo)流盤 ........37
2.3.5 雙面組裝PCBA焊接面元器件焊盤或本體邊緣與插件零件邊緣距離過(guò)小 ..............38
2.3.6 元器件布放不符合自動(dòng)化生產(chǎn)要求 ...............................................................38
2.3.7 元器件布放位置距緊固件太近的設(shè)計(jì)缺陷 .................................................